Issue |
Section |
Title |
File |
Vol 53, No 1 (2024) |
TECHNOLOGIES |
Interconnects Materials for Integrated Circuit Technology Below 5 Nm Node |
|
Vol 52, No 5 (2023) |
INSTRUMENTATION |
Neuromorphic Systems: Devices, Architecture, and Algorithms |
|
Vol 52, No 2 (2023) |
ЛИТОГРАФИЯ |
Cross Sections of Scattering Processes in Electron-Beam Lithography |
|
Vol 52, No 2 (2023) |
INSTRUMENTATION |
Oxide Memristors for ReRAM: Approaches, Characteristics, and Structures |
|
Vol 54, No 1 (2025) |
MODELING |
Calculation of distributions of electron beam energy absorbed in PMMA and Si using various scattering models |
|
Vol 54, No 2 (2025) |
NANOSTRUCTURES |
Electrical characteristics of ruthenium lines with a cross-sectional area less than 1000 nm2 |
|
Vol 54, No 2 (2025) |
INSTRUMENTATION |
Ferroelectric transistors: operating principles, materials, applications |
|
Vol 54, No 3 (2025) |
DIAGNOSTICS |
Structure of thin titanium nitride films deposited by magnetron sputtering |
|